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MCP1702
250 mA Low Quiescent Current LDO Regulator
Features
* * * * * * * 2.0 A Quiescent Current (typical) Input Operating Voltage Range: 2.7V to 13.2V 250 mA Output Current for Output Voltages 2.5V 200 mA Output Current for Output Voltages < 2.5V Low Dropout (LDO) voltage - 625 mV typical @ 250 mA (VOUT = 2.8V) 0.4% Typical Output Voltage Tolerance Standard Output Voltage Options: - 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, 5.0V Output voltage range 1.2V to 5.5V in 0.1V Increments (50 mV increments available upon request) Stable with 1.0 F to 22 F Output Capacitor Short-Circuit Protection Overtemperature Protection
Description
The MCP1702 is a family of CMOS low dropout (LDO) voltage regulators that can deliver up to 250 mA of current while consuming only 2.0 A of quiescent current (typical). The input operating range is specified from 2.7V to 13.2V, making it an ideal choice for two to six primary cell battery-powered applications, 9V alkaline and one or two cell Li-Ion-powered applications. The MCP1702 is capable of delivering 250 mA with only 625 mV (typical) of input to output voltage differential (VOUT = 2.8V). The output voltage tolerance of the MCP1702 is typically 0.4% at +25C and 3% maximum over the operating junction temperature range of -40C to +125C. Line regulation is 0.1% typical at +25C. Output voltages available for the MCP1702 range from 1.2V to 5.0V. The LDO output is stable when using only 1 F of output capacitance. Ceramic, tantalum or aluminum electrolytic capacitors can all be used for input and output. Overcurrent limit and overtemperature shutdown provide a robust solution for any application. Package options include the SOT-23A, SOT-89-3, and TO-92.
*
* * *
Applications
* * * * * * * * * * * * * Battery-powered Devices Battery-powered Alarm Circuits Smoke Detectors CO2 Detectors Pagers and Cellular Phones Smart Battery Packs Low Quiescent Current Voltage Reference PDAs Digital Cameras Microcontroller Power Solar-Powered Instruments Consumer Products Battery Powered Data Loggers
Package Types
3-Pin SOT-23A
VIN 3 MCP1702 1 2 MCP1702 1 2 3
3-Pin SOT-89
VIN
GND VOUT
GND VIN VOUT
Related Literature
* AN765, "Using Microchip's Micropower LDOs", DS00765, Microchip Technology Inc., 2002 * AN766, "Pin-Compatible CMOS Upgrades to BiPolar LDOs", DS00766, Microchip Technology Inc., 2002 * AN792, "A Method to Determine How Much Power a SOT-23 Can Dissipate in an Application", DS00792, Microchip Technology Inc., 2001
3-Pin TO-92 123
Bottom View GND VIN VOUT
(c) 2007 Microchip Technology Inc.
DS22008B-page 1
MCP1702
Functional Block Diagrams
MCP1702
VIN VOUT
Error Amplifier +VIN Voltage Reference +
Overcurrent Overtemperature
GND
Typical Application Circuits
MCP1702
VIN 9V Battery + CIN 1 F Ceramic VOUT VIN GND COUT 1 F Ceramic VOUT 3.3V IOUT 50 mA
DS22008B-page 2
(c) 2007 Microchip Technology Inc.
MCP1702
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
VDD...............................................................................+14.5V All inputs and outputs w.r.t. .............(VSS-0.3V) to (VIN+0.3V) Peak Output Current ...................................................500 mA Storage temperature .....................................-65C to +150C Maximum Junction Temperature ................................... 150C Operating Junction Temperature...................-40C to +125C ESD protection on all pins (HBM;MM)............... 4 kV; 400V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1, ILOAD = 100 A, COUT = 1 F (X7R), CIN = 1 F (X7R), TA = +25C. Boldface type applies for junction temperatures, TJ of -40C to +125C. (Note 7) Parameters Input / Output Characteristics Input Operating Voltage Input Quiescent Current Maximum Output Current VIN Iq IOUT_mA 2.7 -- 250 50 100 150 200 Output Short Circuit Current IOUT_SC -- -- 2.0 -- 100 130 200 250 400 13.2 5 -- -- -- -- -- -- V A mA mA mA mA mA mA Note 1 IL = 0 mA For VR 2.5V For VR < 2.5V, VIN 2.7V For VR < 2.5V, VIN 2.95V For VR < 2.5V, VIN 3.2V For VR < 2.5V, VIN 3.45V VIN = VIN(MIN) (Note 1), VOUT = GND, Current (average current) measured 10 ms after short is applied. Note 2 Note 3 (VOUT(MAX) + VDROPOUT(MAX)) VIN 13.2V, (Note 1) IL = 1.0 mA to 250 mA for VR 2.5V IL = 1.0 mA to 200 mA for VR < 2.5V, VIN = 3.45V Note 4 Sym Min Typ Max Units Conditions
Output Voltage Regulation VOUT Temperature Coefficient Line Regulation Load Regulation
VOUT TCVOUT VOUT/ (VOUTXVIN)
VR-3.0% VR-2.0% -- -0.3 -2.5
VR0.4 % 50 0.1 1.0
VR+3.0% VR+2.0% 150 +0.3 +2.5
V ppm/C %/V %
VOUT/VOUT
Note 1: 2: 3: 4: 5: 6:
7:
The minimum VIN must meet two conditions: VIN 2.7V and VIN VOUT(MAX) + VDROPOUT(MAX). VR is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V. The input voltage VIN = VOUT(MAX) + VDROPOUT(MAX) or VIN = 2.7V (whichever is greater); IOUT = 100 A. TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * Temperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range. Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCVOUT. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured value with an applied input voltage of VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150C rating. Sustained junction temperatures above 150C can impact the device reliability. The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant.
(c) 2007 Microchip Technology Inc.
DS22008B-page 3
MCP1702
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1, ILOAD = 100 A, COUT = 1 F (X7R), CIN = 1 F (X7R), TA = +25C. Boldface type applies for junction temperatures, TJ of -40C to +125C. (Note 7) Parameters Dropout Voltage (Note 1, Note 5) Sym VDROPOUT Min -- -- -- -- -- Output Delay Time Output Noise Power Supply Ripple Rejection Ratio Thermal Shutdown Protection Note 1: 2: 3: 4: 5: 6: TDELAY eN PSRR -- -- -- Typ 330 525 625 750 -- 1000 8 44 -- Max 650 725 975 1100 -- -- Units mV mV mV mV mV s Conditions IL = 250 mA, VR = 5.0V IL = 250 mA, 3.3V VR < 5.0V IL = 250 mA, 2.8V VR < 3.3V IL = 250 mA, 2.5V VR < 2.8V VR < 2.5V, See Maximum Output Current Parameter VIN = 0V to 6V, VOUT = 90% VR RL = 50 resistive f = 100 Hz, COUT = 1 F, IL = 50 mA, VINAC = 100 mV pk-pk, CIN = 0 F, VR = 1.2V
V/(Hz)1/2 IL = 50 mA, f = 1 kHz, COUT = 1 F dB
TSD
--
150
--
C
7:
The minimum VIN must meet two conditions: VIN 2.7V and VIN VOUT(MAX) + VDROPOUT(MAX). VR is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V. The input voltage VIN = VOUT(MAX) + VDROPOUT(MAX) or VIN = 2.7V (whichever is greater); IOUT = 100 A. TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * Temperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range. Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCVOUT. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured value with an applied input voltage of VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150C rating. Sustained junction temperatures above 150C can impact the device reliability. The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant.
TEMPERATURE SPECIFICATIONS (NOTE 1)
Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistance Thermal Resistance, 3L-SOT-23A JA JC Thermal Resistance, 3L-SOT-89 JA JC Thermal Resistance, 3L-TO-92 Note 1: JA JC -- -- -- -- -- -- 336 110 52 10 131.9 66.3 -- -- -- -- -- -- C/W C/W C/W C/W C/W C/W EIA/JEDEC JESD51-7 FR-4 0.063 4-Layer Board EIA/JEDEC JESD51-7 FR-4 0.063 4-Layer Board TJ TJ TA -40 -40 -65 +125 +125 +150 C C C Sym Min Typ Max Units Conditions
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150C rating. Sustained junction temperatures above 150C can impact the device reliability.
DS22008B-page 4
(c) 2007 Microchip Technology Inc.
MCP1702
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated: VR = 2.8V, COUT = 1 F Ceramic (X7R), CIN = 1 F Ceramic (X7R), IL = 100 A, TA = +25C, VIN = VOUT(MAX) + VDROPOUT(MAX).
Note: Junction Temperature (TJ) is approximated by soaking the device under test to an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in Junction temperature over the Ambient temperature is not significant.
5.00 Quiescent Current (A) 4.00 3.00 2.00 1.00 0.00 2 4 6 8 10 12 14 Input Voltage (V)
-45C +25C +90C
VOUT = 1.2V +130C 0C
120.00 GND Current (A) 100.00 80.00 60.00 40.00 20.00 0.00 0 40
Temperature = +25C
VOUT = 1.2V VIN = 2.7V
80
120
160
200
Load Current (mA)
FIGURE 2-1: Voltage.
5.00 Quiescent Current (A) 4.00 3.00 2.00 1.00 0.00 3 5
-45C +25C +90C
Quiescent Current vs. Input
FIGURE 2-4: Current.
120.00 GND Current (A) 100.00 80.00 60.00 40.00 20.00 0.00
Ground Current vs. Load
VOUT = 2.8V +130C
Temperature = +25C VOUT = 5.0V VIN = 6.0V
0C
VOUT = 2.8V VIN = 3.8V
7
9
11
13
0
50
100
150
200
250
Input Voltage (V)
Load Current (mA)
FIGURE 2-2: Voltage.
5.00 Quiescent Current (A) 4.00 3.00
Quiescent Current vs.Input
FIGURE 2-5: Current.
3.00 Quiescent Current (A) 2.50 2.00 1.50 1.00 0.50 0.00
VOUT = 2.8V VIN = 3.8V
Ground Current vs. Load
VOUT = 5.0V +130C
VOUT = 5.0V VIN = 6.0V
IOUT = 0 mA
+90C
VOUT = 1.2V VIN = 2.7V
2.00
-45C
+25C
0C
1.00 6 7 8 9 10 11 12 13 14 Input Voltage (V)
-45
-20
5
30
55
80
105
130
Junction Temperature (C)
FIGURE 2-3: Voltage.
Quiescent Current vs.Input
FIGURE 2-6: Quiescent Current vs. Junction Temperature.
(c) 2007 Microchip Technology Inc.
DS22008B-page 5
MCP1702
Note: Unless otherwise indicated: VR = 2.8V, COUT = 1 F Ceramic (X7R), CIN = 1 F Ceramic (X7R), IL = 100 A, TA = +25C, VIN = VOUT(MAX) + VDROPOUT(MAX).
1.24 Output Voltage (V) 1.23 1.22 1.21 1.20 1.19 1.18 2 4 6 8 10 12 14 Input Voltage (V)
+25C +90C +130C 0C -45C
Output Voltage (V)
VOUT = 1.2V ILOAD = 0.1 mA
1.23 1.22 1.21 1.20
+130C +90C 0C -45C
VOUT = 1.2V
+25C
1.19 1.18 0 20 40 60 80 100 Load Current (mA)
FIGURE 2-7: Voltage.
2.85 2.84 Output Voltage (V) 2.83 2.82 2.81 2.80 2.79 2.78 2.77 3 4 5 6
Output Voltage vs. Input
FIGURE 2-10: Current.
2.83 Output Voltage (V) 2.82 2.81 2.80 2.79 2.78 2.77
Output Voltage vs. Load
VOUT = 2.8V ILOAD = 0.1 mA +90C +130C
VOUT = 2.8V +130C +90C
0C +25C
-45C
+25C -45C
0C
7
8
9
10 11 12 13 14
0
50
100
150
200
250
Input Voltage (V)
Load Current (mA)
FIGURE 2-8: Voltage.
Output Voltage vs. Input
FIGURE 2-11: Current.
5.04 5.03 Output Voltage (V)
Output Voltage vs. Load
5.06 Output Voltage (V) 5.04 5.02 5.00
VOUT = 5.0V ILOAD = 0.1 mA +90C +130C
VOUT = 5.0V +130C +90C
5.02 5.01 5.00 4.99 4.98 4.97 4.96
-45C
0C +25C
0C
-45C
4.98 4.96 6 7 8 9
+25C
10
11
12
13
14
0
50
100
150
200
250
Input Voltage (V)
Load Current (mA)
FIGURE 2-9: Voltage.
Output Voltage vs. Input
FIGURE 2-12: Current.
Output Voltage vs. Load
DS22008B-page 6
(c) 2007 Microchip Technology Inc.
MCP1702
Note: Unless otherwise indicated: VR = 2.8V, COUT = 1 F Ceramic (X7R), CIN = 1 F Ceramic (X7R), IL = 100 A, TA = +25C, VIN = VOUT(MAX) + VDROPOUT(MAX).
1.40 Dropout Voltage (V) 1.30 1.20 1.10 1.00 0.90 0.80 0.70 0.60 100 120 140 160 180 200
-45C VOUT = 1.8V
+130C +90C +25C
0C
Load Current (mA)
FIGURE 2-13: Current.
1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 0 25 50
Dropout Voltage vs. Load
FIGURE 2-16:
Dynamic Line Response.
VOUT = 2.8V +130C +90C +25C +0C -45C
Dropout Voltage (V)
75 100 125 150 175 200 225 250 Load Current (mA)
FIGURE 2-14: Current.
0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 0 25 50
Dropout Voltage vs. Load
FIGURE 2-17:
Dynamic Line Response.
Short Circuit Current (mA)
VOUT = 5.0V +130C +90C +25C +0C -45C
600.00 500.00 400.00 300.00 200.00 100.00 0.00 4 6 8 10
Dropout Voltage (V)
VOUT = 2.8V ROUT < 0.1
75 100 125 150 175 200 225 250 Load Current (mA)
12
14
Input Voltage (V)
FIGURE 2-15: Current.
Dropout Voltage vs. Load
FIGURE 2-18: Input Voltage.
Short Circuit Current vs.
(c) 2007 Microchip Technology Inc.
DS22008B-page 7
MCP1702
Note: Unless otherwise indicated: VR = 2.8V, COUT = 1 F Ceramic (X7R), CIN = 1 F Ceramic (X7R), IL = 100 A, TA = +25C, VIN = VOUT(MAX) + VDROPOUT(MAX).
0.20 0.15 0.10 0.05 0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -0.30 0.20 Line Regulation (%/V) 0.16 0.12
1 mA
VIN = 6V
Load Regulation (%)
VOUT = 1.2V VIN = 2.7V to 13.2V
VIN = 4V
VIN = 10V
VIN = 12V VIN = 13.2V
0.08 0.04 0.00
100 mA
0 mA
VOUT = 1.2V ILOAD = 0.1 mA to 200 mA
-45
-20
5
30
55
80
105
130
-45
-20
5
30
55
80
105
130
Temperature (C)
Temperature (C)
FIGURE 2-19:
Temperature.
0.40 0.30 0.20 0.10 0.00 -0.10 -0.20 -0.30 -0.40 -0.50 -0.60 -45 -20
Load Regulation vs.
FIGURE 2-22:
Temperature.
0.20 Line Regulation (%/V) 0.16 0.12 0.08 0.04 0.00
Line Regulation vs.
Load Regulation (%)
VOUT = 2.8V ILOAD = 1 mA to 250 mA
VOUT = 2.8V VIN = 3.8V to 13.2V 250 mA 200 mA
VIN = 6V VIN = 10V VIN = 3.8V VIN = 13.2V
0 mA 100 mA
5
30
55
80
105
130
-45
-20
5
30
55
80
105
130
Temperature (C)
Temperature (C)
FIGURE 2-20:
Temperature.
0.40 Load Regulation (%) 0.30 0.20 0.10 0.00 -0.10 -45 -20
Load Regulation vs.
FIGURE 2-23:
Temperature.
0.16 Line Regulation (%/V) 0.14 0.12
Line Regulation vs.
VIN = 6V
VOUT = 5.0V ILOAD = 1 mA to 250 mA
VOUT = 5.0V VIN = 6.0V to 13.2V 200 mA 250 mA
0 mA
VIN = 10V
0.10 0.08 0.06
100 mA
VIN = 8V VIN = 13.2V
5
30
55
80
105
130
-45
-20
5
30
55
80
105
130
Temperature (C)
Temperature (C)
FIGURE 2-21:
Temperature.
Load Regulation vs.
FIGURE 2-24: Temperature.
Line Regulation vs.
DS22008B-page 8
(c) 2007 Microchip Technology Inc.
MCP1702
Note: Unless otherwise indicated: VR = 2.8V, COUT = 1 F Ceramic (X7R), CIN = 1 F Ceramic (X7R), IL = 100 A, TA = +25C, VIN = VOUT(MAX) + VDROPOUT(MAX).
0 -10 -20 PSRR (dB) -30 -40 -50 -60 -70 -80 -90 0.01
VR=1.2V COUT=1.0 F ceramic X7R VIN=2.7V CIN=0 F IOUT=1.0 mA
0.1
1 10 Frequency (kHz)
100
1000
FIGURE 2-25: Power Supply Ripple Rejection vs. Frequency.
0 -10 -20 PSRR (dB) -30 -40 -50 -60 -70 -80 -90 0.01
VR=5.0V COUT=1.0 F ceramic X7R VIN=6.0V CIN=0 F IOUT=1.0 mA
FIGURE 2-28:
Power Up Timing.
0.1
1 10 Frequency (kHz)
100
1000
FIGURE 2-26: Power Supply Ripple Rejection vs. Frequency.
100
VR=5.0V, VIN=6.0V
FIGURE 2-29:
Dynamic Load Response.
IOUT=50 mA
10 Noise (V/ Hz) 1 0.1 0.01 0.001 0.01
VR=2,8V, VIN=3.8V
VR=1.2V, VIN=2.7V
0.1
1 10 Frequency (kHz)
100
1000
FIGURE 2-27:
Output Noise vs. Frequency.
FIGURE 2-30:
Dynamic Load Response.
(c) 2007 Microchip Technology Inc.
DS22008B-page 9
MCP1702
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No. SOT-23A 1 2 3 -
PIN FUNCTION TABLE
Pin No. SOT-89 1 3 2, Tab - Pin No. TO-92 1 3 2 - Symbol GND VOUT VIN NC Ground Terminal Regulated Voltage Output Unregulated Supply Voltage No connection Function
3.1
Ground Terminal (GND)
3.3
Regulator ground. Tie GND to the negative side of the output and the negative side of the input capacitor. Only the LDO bias current (2.0 A typical) flows out of this pin; there is no high current. The LDO output regulation is referenced to this pin. Minimize voltage drops between this pin and the negative side of the load.
Unregulated Input Voltage Pin (VIN)
3.2
Regulated Output Voltage (VOUT)
Connect VOUT to the positive side of the load and the positive terminal of the output capacitor. The positive side of the output capacitor should be physically located as close to the LDO VOUT pin as is practical. The current flowing out of this pin is equal to the DC load current.
Connect VIN to the input unregulated source voltage. Like all LDO linear regulators, low source impedance is necessary for the stable operation of the LDO. The amount of capacitance required to ensure low source impedance will depend on the proximity of the input source capacitors or battery type. For most applications, 1 F of capacitance will ensure stable operation of the LDO circuit. For applications that have load currents below 100 mA, the input capacitance requirement can be lowered. The type of capacitor used can be ceramic, tantalum or aluminum electrolytic. The low ESR characteristics of the ceramic will yield better noise and PSRR performance at highfrequency.
DS22008B-page 10
(c) 2007 Microchip Technology Inc.
MCP1702
4.0
4.1
DETAILED DESCRIPTION
Output Regulation 4.3 Overtemperature
A portion of the LDO output voltage is fed back to the internal error amplifier and compared with the precision internal bandgap reference. The error amplifier output will adjust the amount of current that flows through the P-Channel pass transistor, thus regulating the output voltage to the desired value. Any changes in input voltage or output current will cause the error amplifier to respond and adjust the output voltage to the target voltage (refer to Figure 4-1).
4.2
Overcurrent
The MCP1702 internal circuitry monitors the amount of current flowing through the P-Channel pass transistor. In the event of a short-circuit or excessive output current, the MCP1702 will turn off the P-Channel device for a short period, after which the LDO will attempt to restart. If the excessive current remains, the cycle will repeat itself.
The internal power dissipation within the LDO is a function of input-to-output voltage differential and load current. If the power dissipation within the LDO is excessive, the internal junction temperature will rise above the typical shutdown threshold of 150C. At that point, the LDO will shut down and begin to cool to the typical turn-on junction temperature of 130C. If the power dissipation is low enough, the device will continue to cool and operate normally. If the power dissipation remains high, the thermal shutdown protection circuitry will again turn off the LDO, protecting it from catastrophic failure.
MCP1702
VIN VOUT
Error Amplifier +VIN Voltage Reference +
Overcurrent Overtemperature
GND
FIGURE 4-1:
Block Diagram.
(c) 2007 Microchip Technology Inc.
DS22008B-page 11
MCP1702
5.0 FUNCTIONAL DESCRIPTION
5.2 Output
The MCP1702 CMOS LDO linear regulator is intended for applications that need the lowest current consumption while maintaining output voltage regulation. The operating continuous load range of the MCP1702 is from 0 mA to 250 mA (VR 2.5V). The input operating voltage range is from 2.7V to 13.2V, making it capable of operating from two or more alkaline cells or single and multiple Li-Ion cell batteries. The maximum rated continuous output current for the MCP1702 is 250 mA (VR 2.5V). For applications where VR < 2.5V, the maximum output current is 200 mA. A minimum output capacitance of 1.0 F is required for small signal stability in applications that have up to 250 mA output current capability. The capacitor type can be ceramic, tantalum or aluminum electrolytic. The esr range on the output capacitor can range from 0 to 2.0.
5.1
Input
The input of the MCP1702 is connected to the source of the P-Channel PMOS pass transistor. As with all LDO circuits, a relatively low source impedance (10) is needed to prevent the input impedance from causing the LDO to become unstable. The size and type of the capacitor needed depends heavily on the input source type (battery, power supply) and the output current range of the application. For most applications (up to 100 mA), a 1 F ceramic capacitor will be sufficient to ensure circuit stability. Larger values can be used to improve circuit AC performance.
5.3
Output Rise time
When powering up the internal reference output, the typical output rise time of 500 s is controlled to prevent overshoot of the output voltage. There is also a startup delay time that ranges from 300 s to 800 s based on loading. The startup time is separate from and precedes the Output Rise Time. The total output delay is the Startup Delay plus the Output Rise time.
DS22008B-page 12
(c) 2007 Microchip Technology Inc.
MCP1702
6.0
6.1
APPLICATION CIRCUITS AND ISSUES
Typical Application
EQUATION 6-2:
T J ( MAX ) = P TOTAL x R JA + T AMAX Where: TJ(MAX) PTOTAL RJA TAMAX = = = Maximum continuous junction temperature Total device power dissipation Thermal resistance from junction to ambient Maximum ambient temperature
The MCP1702 is most commonly used as a voltage regulator. It's low quiescent current and low dropout voltage makes it ideal for many battery-powered applications. MCP1702
VOUT 1.8V IOUT 150 mA GND VIN VOUT COUT 1 F Ceramic VIN (2.8V to 3.2V) CIN 1 F Ceramic
The maximum power dissipation capability for a package can be calculated given the junction-toambient thermal resistance and the maximum ambient temperature for the application. The following equation can be used to determine the package maximum internal power dissipation.
FIGURE 6-1: 6.1.1
Typical Application Circuit.
EQUATION 6-3:
( T J ( MAX ) - T A ( MAX ) ) P D ( MAX ) = --------------------------------------------------R JA = = Maximum device power dissipation Maximum continuous junction temperature Maximum ambient temperature = Thermal resistance from junction to ambient
APPLICATION INPUT CONDITIONS
Package Type = SOT-23A Where:
Input Voltage Range = 2.8V to 3.2V VIN maximum = 3.2V VOUT typical = 1.8V IOUT = 150 mA maximum
PD(MAX) TJ(MAX) TA(MAX) RJA
6.2
6.2.1
Power Calculations
POWER DISSIPATION
The internal power dissipation of the MCP1702 is a function of input voltage, output voltage and output current. The power dissipation, as a result of the quiescent current draw, is so low, it is insignificant (2.0 A x VIN). The following equation can be used to calculate the internal power dissipation of the LDO.
EQUATION 6-4:
T J ( RISE ) = P D ( MAX ) x R JA Where: TJ(RISE) = Rise in device junction temperature over the ambient temperature Maximum device power dissipation Thermal resistance from junction to ambient
EQUATION 6-1:
P LDO = ( V IN ( MAX ) ) - V OUT ( MIN ) ) x I OUT ( MAX ) ) Where: PLDO VIN(MAX) VOUT(MIN) = = = LDO Pass device internal power dissipation Maximum input voltage LDO minimum output voltage RJA PTOTAL =
EQUATION 6-5:
T J = T J ( RISE ) + T A Where: TJ TJ(RISE) = = Junction Temperature Rise in device junction temperature over the ambient temperature Ambient temperature
The maximum continuous operating junction temperature specified for the MCP1702 is +125C. To estimate the internal junction temperature of the MCP1702, the total internal power dissipation is multiplied by the thermal resistance from junction to ambient (RJA). The thermal resistance from junction to ambient for the SOT-23A pin package is estimated at 336C/W.
TA
(c) 2007 Microchip Technology Inc.
DS22008B-page 13
MCP1702
6.3 Voltage Regulator Junction Temperature Estimate
To estimate the internal junction temperature, the calculated temperature rise is added to the ambient or offset temperature. For this example, the worst-case junction temperature is estimated below. TJ TJ = = TJRISE + TA(MAX) 113.3C Internal power dissipation, junction temperature rise, junction temperature and maximum power dissipation are calculated in the following example. The power dissipation, as a result of ground current, is small enough to be neglected.
6.3.1
Package
POWER DISSIPATION EXAMPLE
Package Type = SOT-23A
Maximum Package Power Dissipation at +40C Ambient Temperature SOT-23 (336.0C/Watt = RJA) PD(MAX) PD(MAX) PD(MAX) PD(MAX) PD(MAX) PD(MAX) = = = = = = (125C - 40C) / 336C/W 253 milli-Watts (125C - 40C) / 52C/W 1.635 Watts (125C - 40C) / 131.9C/W 644 milli-Watts
Input Voltage VIN VOUT IOUT TA(MAX) = = = = 2.8V to 3.2V 1.8V 150 mA +40C LDO Output Voltages and Currents
SOT-89 (52C/Watt = RJA)
Maximum Ambient Temperature Internal Power Dissipation Internal Power dissipation is the product of the LDO output current times the voltage across the LDO (VIN to VOUT). PLDO(MAX) PLDO PLDO = = = (VIN(MAX) - VOUT(MIN)) x IOUT(MAX) (3.2V - (0.97 x 1.8V)) x 150 mA 218.1 milli-Watts
TO92 (131.9C/Watt = RJA)
6.4
Voltage Reference
Device Junction Temperature Rise
The internal junction temperature rise is a function of internal power dissipation and the thermal resistance from junction to ambient for the application. The thermal resistance from junction to ambient (RJA) is derived from an EIA/JEDEC standard for measuring thermal resistance for small surface mount packages. The EIA/ JEDEC specification is JESD51-7, "High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages". The standard describes the test method and board specifications for measuring the thermal resistance from junction to ambient. The actual thermal resistance for a particular application can vary depending on many factors, such as copper area and thickness. Refer to AN792, "A Method to Determine How Much Power a SOT-23 Can Dissipate in an Application", (DS00792), for more information regarding this subject. TJ(RISE) TJRISE TJRISE = = = PTOTAL x RqJA 218.1 milli-Watts x 336.0C/Watt 73.3C
The MCP1702 can be used not only as a regulator, but also as a low quiescent current voltage reference. In many microcontroller applications, the initial accuracy of the reference can be calibrated using production test equipment or by using a ratio measurement. When the initial accuracy is calibrated, the thermal stability and line regulation tolerance are the only errors introduced by the MCP1702 LDO. The low-cost, low quiescent current and small ceramic output capacitor are all advantages when using the MCP1702 as a voltage reference.
Ratio Metric Reference 2 A Bias MCP1702 VIN CIN VOUT 1 F GND PIC(R) Microcontroller COUT 1 F VREF ADO AD1 Bridge Sensor
FIGURE 6-2: voltage reference.
Using the MCP1702 as a
DS22008B-page 14
(c) 2007 Microchip Technology Inc.
MCP1702
6.5 Pulsed Load Applications
For some applications, there are pulsed load current events that may exceed the specified 250 mA maximum specification of the MCP1702. The internal current limit of the MCP1702 will prevent high peak load demands from causing non-recoverable damage. The 250 mA rating is a maximum average continuous rating. As long as the average current does not exceed 250 mA, pulsed higher load currents can be applied to the MCP1702. The typical current limit for the MCP1702 is 500 mA (TA +25C).
(c) 2007 Microchip Technology Inc.
DS22008B-page 15
MCP1702
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
3-Pin SOT-23A Standard Extended Temp Example:
XXNN
Symbol
Voltage *
Symbol
Voltage *
HA 1.2 HF 3.0 HB 1.5 HG 3.3 HC 1.8 HH 4.0 HD 2.5 HJ 5.0 HE 2.8 -- -- * Custom output voltages available upon request. Contact your local Microchip sales office for more information. Standard Extended Temp
HANN
3-Lead SOT-89
Example
XXXYYWW NNN
Symbol
Voltage *
Symbol
Voltage *
HA 1.2 HF 3.0 HB 1.5 HG 3.3 HC 1.8 HH 4.0 HD 2.5 HJ 5.0 HE 2.8 -- -- * Custom output voltages available upon request. Contact your local Microchip sales office for more information.
HA0619
256
3-Lead TO-92
Example
XXXXXX XXXXXX XXXXXX YWWNNN
1702 1202E e3 TO^^ 619256
Legend: XX...X Y YY WW NNN
e3
* Note:
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
DS22008B-page 16
(c) 2007 Microchip Technology Inc.
MCP1702
3-Lead Plastic Small Outline Transistor (CB) [SOT-23A]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
D e1 e 2 1
E E1
N b
A
A2
c
A1
Units Dimension Limits Number of Pins Lead Pitch Outside Lead Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness N e e1 A A2 A1 E E1 D L c 0.89 0.90 0.00 2.10 1.20 2.70 0.15 0 0.09 MIN MILLIMETERS NOM 3 0.95 BSC 1.90 BSC - - - - - - - - - 1.45 1.30 0.15 3.00 1.80 3.10 0.60 30 0.26 MAX
L
Lead Width b 0.30 - 0.51 Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-130B
(c) 2007 Microchip Technology Inc.
DS22008B-page 17
MCP1702
3-Lead Plastic Small Outline Transistor Header (MB) [SOT-89]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
D D1
E H
L
1 b1
2 b e e1
N b1 E1
A C
Units Dimension Limits Number of Leads Pitch Outside Lead Pitch Overall Height Overall Width Molded Package Width at Base Molded Package Width at Top Overall Length Tab Length Foot Length Lead Thickness Lead 2 Width N e e1 A H E E1 D D1 L c b 1.40 3.94 2.29 2.13 4.39 1.40 0.79 0.35 0.41 MILLIMETERS MIN 3 1.50 BSC 3.00 BSC 1.60 4.25 2.60 2.29 4.60 1.83 1.20 0.44 0.56 MAX
Leads 1 & 3 Width b1 0.36 0.48 Notes: 1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-029B
DS22008B-page 18
(c) 2007 Microchip Technology Inc.
MCP1702
3-Lead Plastic Transistor Outline (TO) [TO-92]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
E
A
1
N
L
12
3
b e c D
R
Units Dimension Limits Number of Pins Pitch Bottom to Package Flat Overall Width Overall Length Molded Package Radius Tip to Seating Plane Lead Thickness N e D E A R L c .125 .175 .170 .080 .500 .014 MIN 3 .050 BSC .165 .205 .210 .105 - .021 INCHES MAX
Lead Width b .014 .022 Notes: 1. Dimensions A and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-101B
(c) 2007 Microchip Technology Inc.
DS22008B-page 19
MCP1702
NOTES:
DS22008B-page 20
(c) 2007 Microchip Technology Inc.
MCP1702
APPENDIX A: REVISION HISTORY
Revision B (May 2007)
* All Pages: Corrected minor errors in document. * Page 4: Added junction-to-case information to Temperature Specifications table. * Page 16: Updated Package Outline Drawings in Section 7.0 "Packaging Information". * Page 21: Updated Revison History. * Page 23: Corrected examples in "Product Identification System".
Revision A (September 2006)
* Original Release of this Document.
(c) 2007 Microchip Technology Inc.
DS22008B-page 21
MCP1702
NOTES:
DS22008B-page 22
(c) 2007 Microchip Technology Inc.
MCP1702
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device XXX X X X/ XX Examples:
a) MCP1702T-1202E/CB: 1.2V LDO Positive Voltage Regulator, SOT-23A-3 pkg. MCP1702T-1802E/MB: 1.8V LDO Positive Voltage Regulator, SOT-89-3 pkg. MCP1702T-2502E/CB: 2.5V LDO Positive Voltage Regulator, SOT-23A-3 pkg. MCP1702T-3002E/CB: 3.0V LDO Positive Voltage Regulator, SOT-23A-3 pkg. MCP1702T-3002E/MB: 3.0V LDO Positive Voltage Regulator, SOT-89-3 pkg. MCP1702T-3302E/CB: 3.3V LDO Positive Voltage Regulator, SOT-23A-3 pkg. MCP1702T-3302E/MB: 3.3V LDO Positive Voltage Regulator, SOT-89-3 pkg. MCP1702T-4002E/CB: 4.0V LDO Positive Voltage Regulator, SOT-23A-3 pkg. MCP1702-5002E/TO: 5.0V LDO Positive Voltage Regulator, TO-92 pkg.
Tape Output Feature Tolerance Temp. Package and Reel Voltage Code
b)
Device: Tape and Reel: Output Voltage *: MCP1702: 2 A Low Dropout Positive Voltage Regulator T = Tape and Reel
c)
12 = 1.2V "Standard" 15 = 1.5V "Standard" 18 = 1.8V "Standard" 25 = 2.5V "Standard" 28 = 2.8V "Standard" 30 = 3.0V "Standard" 33 = 3.3V "Standard" 40 = 4.0V "Standard" 50 = 5.0V "Standard" *Contact factory for other output voltage options. 0 2 E = Fixed = 2.0% (Standard) = -40C to +125C
d)
e)
f)
Extra Feature Code: Tolerance: Temperature: Package Type:
g)
h)
i)
CB = 3-Pin SOT-23A (equivalent to EIAJ SC-59) MB = 3-Pin SOT-89 TO = 3-Pin TO-92
j)
MCP1702T-5002E/CB: 5.0V LDO Positive Voltage Regulator, SOT-23A-3 pkg. MCP1702T-5002E/MB: 5.0V LDO Positive Voltage Regulator, SOT-89-3 pkg.
k)
(c) 2007 Microchip Technology Inc.
DS22008B-page 23
MCP1702
NOTES:
DS22008B-page 24
(c) 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2007 Microchip Technology Inc.
DS22008B-page 25
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Habour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7250 Fax: 86-29-8833-7256
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EUROPE
Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
12/08/06
DS22008B-page 26
(c) 2007 Microchip Technology Inc.

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